TIC10024-Q1 Datasheet, PDF (72/81 Pages) Texas Instruments – 24-Input Multiple Switch Detection Interface (MSDI) Device With Adjustable Wetting Current for Automotive Systems

TIC10024-Q1
SCPS268 – SEPTEMBER 2017
12 Layout
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12.1 Layout Guidelines
Figure 48 illustrates an example of a PCB layout with the TIC10024-Q1. Some key considerations are:
1. Decouple the V_S and V_DD pins with capacitor using recommended values from section Power Supply
Recommendations and place them as close to the pin as possible. Make sure that the capacitor voltage rating
is sufficient for the V_S and V_DD supplies.
2. Keep the input lines as short as possible.
3. Use a solid ground plane to help distribute heat and reduce electromagnetic interference (EMI) noise
pickup.
4. Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible, and only make perpendicular crossings when necessary.
5. To achieve good thermal performance, the exposed thermal pad underneath the device must be soldered
to the board and flooded with VIAs to ground planes. For simple double-sided PCBs where there are no
internal layers, the surface layers can be used to remove heat. For multilayer PCBs, internal ground planes
can be used for heat removal.
7. Minimize the inductive parasitic between the INx input capacitors and the thermal pad ground return.
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