TIC10024-Q1 Datasheet, PDF (4/81 Pages) Texas Instruments – 24-Input Multiple Switch Detection Interface (MSDI) Device With Adjustable Wetting Current for Automotive Systems

TIC10024-Q1
SCPS268 – SEPTEMBER 2017
PIN
NO.
NAME
15
CS
16
SCLK
17
SI
18
SO
19
V_DD
20
CAP_A
21
RESET
22
CAP_Pre
23
CAP_D
24
INT
25
IN2
26
IN3
27
IN4
28
DGND
29
IN5
30
IN6
31
IN7
32
IN8
33
IN9
34
IN10
35
IN11
36
IN12
37
V_S
38
V_S
---
EP
TYPE ⁽¹⁾
I
I
I
O
P
I/O
I
I/O
I/O
O
I/O
I/O
I/O
P
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
P
P
P
Pin Functions (continued)
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DESCRIPTION
Active-low input. Chip select from the master for the SPI Interface.
Serial clock output from the master for the SPI Interface
Serial data input for the SPI Interface.
Serial data output for the SPI Interface
3.3 V to 5.0 V logic supply for the SPI communication. The SPI I/Os are not fail-safe
protected: VDD needs to be present during any SPI traffic to avoid excessive leakage
currents and corrupted SPI I/O logic levels.
External capacitor connection for the analog LDO. Use capacitance value of 100nF.
Keep RESET low for normal operation and drive RESET high and release it to perform a
hardware reset of the device. The RESET pin is connected to ground via a 1MΩ pull-down
resistor. If not used, the RESET pin shall be grounded to avoid any accidental device reset
due to coupled noise onto this pin.
External capacitor connection for the pre-regulator. Use capacitance value of 1μF.
External capacitor connection for the digital LDO. Use capacitance value of 100nF.
Open drain output. Pulled low (internally) upon change of state on the input or occurrence of
a special event.
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground for digital circuitry
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground/V_BAT switch monitoring input with configurable current sink or source.
Ground switch monitoring input with current source
Ground switch monitoring input with current source
Ground switch monitoring input with current source
Power supply input pin.
Power supply input pin.
Exposed Pad. The exposed pad is not electrically connected to AGND or DGND. Connect
EP to the board ground to achieve rated thermal and ESD performance.
4
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