SM470R1B1M-HT Datasheet, PDF (7/67 Pages) Texas Instruments – 16/32-BIT RISC FLASH MICROCONTROLLER

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PAD NO.
139
140
141
142
143
144
145
146
147
148
149
150
151
152
X MIN
10.08
10.08
10.08
10.08
10.08
10.08
10.08
10.08
10.08
10.08
10.08
10.08
10.08
4.9
SM470R1B1M-HT
SPNS155F – SEPTEMBER 2009 – REVISED AUGUST 2012
Table 2. Bond Pad Coordinates (continued)
BOND PAD COORDINATES (µm)
Y MIN
X MAX
1672.965
75.18
1561.49
75.18
1372.245
75.18
1260.77
75.18
1149.295
75.18
1037.82
75.18
926.345
75.18
814.87
75.18
703.395
75.18
514.15
75.18
402.675
75.18
291.2
75.18
179.725
75.18
5154.1
69.93
Y MAX
1738.065
1626.59
1437.345
1325.87
1214.395
1102.92
991.445
879.97
768.495
579.25
467.775
356.3
244.825
5219.13
PAD SIZE (µm)
X
Y
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.1
65.03
65.03
Copyright © 2009–2012, Texas Instruments Incorporated
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