SM470R1B1M-HT Datasheet, PDF (3/67 Pages) Texas Instruments – 16/32-BIT RISC FLASH MICROCONTROLLER

SM470R1B1M-HT
www.ti.com
SPNS155F – SEPTEMBER 2009 – REVISED AUGUST 2012
T_A
–55°C to 220°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
KGD
SM470R1B1MKGDS1
CQFP-HFQ
SM470R1B1MHFQS
CQFP-HKP
SM470R1B1MHKPS
TOP-SIDE MARKING
SM470R1B1MKGDS1
SM470R1B1MHFQS
SM470R1B1MHKPS
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DIE LAYOUT
Table 1. Bare Die Information
DIE SIZE
208.858 x 211.890 mils/
5304.99 x 5382.01 µm
DIE PAD SIZE
DIE PAD
COORDINATES ⁽¹⁾
65.1 x 65.1(µm)
See Table 2
DIE
THICKNESS
11 mils
DIE PAD
COMPOSITION
AlCu
BACKSIDE
FINISH
Silicon with
backgrind
BACKSIDE
POTENTIAL
Ground
(1) Pads 12, 22, 26, 136, 143, 146, 149 and 152 are test pads, no connections required. It is highly recommended to leave them open.
Copyright © 2009–2012, Texas Instruments Incorporated
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