LM3S1601 Datasheet, PDF (550/587 Pages) Texas Instruments – ARM and Thumb are registered trademarks and Cortex is a trademark

Electrical Characteristics
Table 18-15. Hibernation Module AC Characteristics (continued)
Parameter
No
Parameter
Parameter Name
Min Nom Max
Unit
H7
t_{HIB_TO_VDD}
HIB deassert to VDD and VDD25 at minimum
-
-
250
μs
operational level
a. This parameter is highly sensitive to PCB layout and trace lengths, which may make this parameter time longer. Care
must be taken in PCB design to minimize trace lengths and RLC (resistance, inductance, capacitance).
Figure 18-10. Hibernation Module Timing
32.768 KHz
(internal)
H1
H2
HIB
H4
WAKE
H3
18.2.7
18.2.8
General-Purpose I/O (GPIO)
Note: All GPIOs are 5 V-tolerant.
Table 18-16. GPIO Characteristics
Parameter Parameter Name Condition
Min
Nom
Max
Unit
2-mA drive
17
26
ns
t_GPIOR
GPIO Rise Time
(from 20% to 80%
of V_DD)
4-mA drive
8-mA drive
9
13
ns
-
6
9
ns
8-mA drive with slew rate control
10
12
ns
2-mA drive
17
25
ns
t_GPIOF
GPIO Fall Time
(from 80% to 20%
of V_DD)
4-mA drive
8-mA drive
8
12
ns
-
6
10
ns
8-mA drive with slew rate control
11
13
ns
Synchronous Serial Interface (SSI)
Table 18-17. SSI Characteristics
Parameter
No.
S1
S2
S3
S4
S5
S6
S7
S8
Parameter Parameter Name
Min Nom Max
t_{clk_per}
SSIClk cycle time
2
t_{clk_high}
SSIClk high time
-
t_{clk_low}
SSIClk low time
-
t_clkrf
SSIClk rise/fall time^a
-
t_DMd
Data from master valid delay time
0
t_DMs
Data from master setup time
1
t_DMh
Data from master hold time
2
t_DSs
Data from slave setup time
1
-
65024
0.5
-
0.5
-
6
10
-
1
-
-
-
-
-
-
Unit
system clocks
t clk_per
t clk_per
ns
system clocks
system clocks
system clocks
system clocks
550
June 19, 2012
Texas Instruments-Production Data