THS8200 Datasheet, PDF (97/97 Pages) Texas Instruments – ALL FORMAT OVERSAMPLED COMPONENT VIDEO/PC GRAPHICS D/A SYSTEM WITH THREE 11-BIT DACS,CGMS DATA INSERTION

8 Mechanical Information
PFP (S-PQFP-G80)
PowerPAD PLASTIC QUAD FLATPACK
0,50
0,27
0,17
0,08 M
60
41
61
40
Thermal Pad
(see Note D)
80
21
0,13 NOM
1
1,05
0,95
20
9,50 TYP
12,20
11,80 ^SQ
14,20
13,80 ^SQ
Gage Plane
0,25
0,15
0,05
0,75
0,45
0°–ā7°
1,20 MAX
Seating Plane
0,08
4146925/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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