LM3S818-IQN50-C2 Datasheet, PDF (523/569 Pages) Texas Instruments – LM3S818 Microcontroller

NRND: Not recommended for new designs.
Stellaris^® LM3S818 Microcontroller
18
Operating Characteristics
Table 18-1. Temperature Characteristics
Characteristic
Industrial operating temperature range
Extended operating temperature range
Unpowered storage temperature range
Symbol
T_A
T_A
T_S
Value
-40 to +85
-40 to +105
-65 to +150
Unit
°C
°C
°C
Table 18-2. Thermal Characteristics
Characteristic
Thermal resistance (junction to ambient)^a
Junction temperature^b
Maximum junction temperature
Symbol
Θ_JA
T_J
T_JMAX
Value
50 (48-pin QFP)
T_A + (P • Θ_JA)
115
c
Unit
°C/W
°C
°C
a. Junction to ambient thermal resistance θ_JA numbers are determined by a package simulator.
b. Power dissipation is a function of temperature.
c. T_JMAX calculation is based on power consumption values and conditions as specified in “Power Specifications”.
Table 18-3. ESD Absolute Maximum Ratings^a
Parameter Name
Min
Nom
V_ESDHBM
-
-
V_ESDCDM
-
-
V_ESDMM
-
-
a. All Stellaris parts are ESD tested following the JEDEC standard.
Max
2.0
1.0
100
Unit
kV
kV
V
June 18, 2012
523
Texas Instruments-Production Data