LAN83C175 Datasheet, PDF (90/92 Pages) SMSC Corporation – Ethernet CARDBUS Integrated Controller With Modem Support

Table 6 - Package Dimensions
MIN
NOMINAL
MAX
REMARK
A
~
~
1.60
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
1.35
~
1.45
Body Thickness
D
29.80
D/2
14.90
30.00
15.00
30.20
15.10
X Span
1_{/2 X Span Measure from Centerline}
D1
27.90
28.00
28.10
X body Size
E
29.80
E/2
14.90
30.00
15.00
30.20
15.10
Y Span
1_{/2 Y Span Measure from Centerline}
E1
27.90
28.00
28.10
Y body Size
H
0.09
~
0.23
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length from Centerline
L1
~
1.00
~
Lead Length
e
0.50 Basic
Lead Pitch
q
0^o
~
7^o
Lead Foot Angle
W
0.17
~
0.27
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.08
Coplanarity
Notes:
1 _{Controlling Unit: millimeter}
2 _{Tolerance on the position of the leads is ± 0.04 mm maximum}
3 _{Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold}
protrusion is 0.25 mm
4 _{Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is}
0.78-1.08 mm
5 _{Details of pin 1 identifier are optional but must be located within the zone indicated}
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