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| PIC16LF1454 Datasheet, PDF (365/418 Pages) Microchip Technology – 14/20-Pin Flash, 8-Bit USB Microcontrollers with XLP Technology | |||
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PIC16(L)F1454/5/9
29.7 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ï£ TA ï£ +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
ï±JA Thermal Resistance Junction to Ambient
70
ï°C/W 14-Pin PDIP package
95.3
ï°C/W 14-Pin SOIC package
100
ï°C/W 14-Pin TSSOP package
45.7
ï°C/W 16-Pin QFN 4x4mm package
62.2
ï°C/W 20-pin PDIP package
77.7
ï°C/W 20-pin SOIC package
87.3
ï°C/W 20-pin SSOP package
43.0
ï°C/W 20-pin QFN 4x4mm package
TH02
ï±JC Thermal Resistance Junction to Case
32
ï°C/W 14-Pin PDIP package
31
ï°C/W 14-Pin SOIC package
24.4
ï°C/W 14-Pin TSSOP package
6.3
ï°C/W 16-Pin QFN 4x4mm package
27.5
ï°C/W 20-pin PDIP package
23.1
ï°C/W 20-pin SOIC package
31.1
ï°C/W 20-pin SSOP package
5.3
ï°C/W 20-pin QFN 4x4mm package
TH03
TJMAX Maximum Junction Temperature
150
ï°C
TH04
TH05
PD Power Dissipation
PINTERNAL Internal Power Dissipation
â
W
PD = PINTERNAL + PI/O
â
W
PINTERNAL = IDD x VDD(1)
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
â
W
PI/O = ï (IOL * VOL) + ï (IOH * (VDD - VOH))
â
W
PDER = PDMAX (TJ - TA)/ï±JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
ï£ 2012 Microchip Technology Inc.
Preliminary
DS41639A-page 365
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