PIC16LF1454 Datasheet, PDF(353/418 Page) Microchip Technology – 14/20-Pin Flash, 8-Bit USB Microcontrollers with XLP Technology

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PIC16LF1454 Datasheet, PDF (353/418 Pages) Microchip Technology – 14/20-Pin Flash, 8-Bit USB Microcontrollers with XLP Technology

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PIC16(L)F1454/5/9

29.0 ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings(â )

Ambient temperature under bias....................................................................................................... -40Â°C to +125Â°C

Storage temperature ........................................................................................................................ -65Â°C to +150Â°C

Voltage on VDD with respect to VSS, PIC16LF1454/5/9 ..................................................................... -0.3V to +6.5V

Voltage on VDD with respect to VSS, PIC16LF1454/5/9 ..................................................................... -0.3V to +4.0V

Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V

Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation(1) ............................................................................................................................... 800 mW

Maximum current out of VSS pin, -40Â°C ï£ TA ï£ +85Â°C for industrial............................................................... 396 mA

Maximum current out of VSS pin, -40Â°C ï£ TA ï£ +125Â°C for extended ............................................................ 114 mA

Maximum current into VDD pin, -40Â°C ï£ TA ï£ +85Â°C for industrial.................................................................. 292 mA

Maximum current into VDD pin, -40Â°C ï£ TA ï£ +125Â°C for extended ............................................................... 107 mA

Clamp current, IK (VPIN < 0 or VPIN > VDD)ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï±ï 20 mA

Maximum output current sunk by any I/O pin.................................................................................................... 25 mA

Maximum output current sourced by any I/O pin .............................................................................................. 25 mA

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD â ï¥ IOH} + ï¥ {(VDD â VOH) x IOH} + ï¥(VOl x

IOL).

â NOTICE: Stresses above those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for

extended periods may affect device reliability.

ï£ 2012 Microchip Technology Inc.

Preliminary

DS41639A-page 353

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