PIC32MX1XX_12 Datasheet, PDF (251/328 Pages) Microchip Technology – 32-bit Microcontrollers (up to 128 KB Flash and 32 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

PIC32MX1XX/2XX
TABLE 29-11: DC CHARACTERISTICS: PROGRAM MEMORY
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +105°C for V-temp
Param.
No.
Symbol
Characteristics
Min. Typical⁽¹⁾ Max. Units
Conditions
Program Flash Memory⁽³⁾
D130 EP
Cell Endurance
20,000 —
— E/W
—
D131 VPR
VDD for Read
2.3
—
3.6
V
—
D132 VPEW VDD for Erase or Write
2.3
—
3.6
V
—
D134 TRETD Characteristic Retention
20
—
— Year Provided no other specifications
are violated
D135 IDDP Supply Current during
—
10
— mA
—
Programming
TWW Word Write Cycle Time
—
411
—
See Note 4
D136 TRW Row Write Cycle Time
—
6675
—
See Note 2,4
D137 TPE
Page Erase Cycle Time
—
20011
—
See Note 4
TCE
Chip Erase Cycle Time
—
80180
—
See Note 4
Note 1:
2:
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities
during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus
loads are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The
default Arbitration mode is mode 1 (CPU has lowest priority).
3: Refer to the “PIC32 Flash Programming Specification” (DS61145) for operating conditions during
programming and erase cycles.
4: This parameter depends on FRC accuracy (See Table 29-17) and FRC tuning values (See Register 8-2).
 2011-2012 Microchip Technology Inc.
Preliminary
DS61168E-page 251