PIC32MX1XX_12 Datasheet, PDF (244/328 Pages) Microchip Technology – 32-bit Microcontrollers (up to 128 KB Flash and 32 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

PIC32MX1XX/2XX
29.1 DC Characteristics
TABLE 29-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)⁽¹⁾
Temp. Range
(in °C)
Max. Frequency
PIC32MX1XX/2XX
DC5
DC5b
Note 1:
2.3-3.6V
-40°C to +85°C
40 MHz
2.3-3.6V
-40°C to +105°C
40 MHz
Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below VDDMIN. Refer to
parameter BO10 in Table 29-10 for BOR values.
TABLE 29-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
V-temp Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD – S IOH)
I/O Pin Power Dissipation:
I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation
Symbol Min. Typical Max. Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+140
°C
TA
-40
—
+105
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
TABLE 29-3: THERMAL PACKAGING CHARACTERISTICS
Characteristics
Symbol Typical Max. Unit Notes
Package Thermal Resistance, 28-pin SSOP
JA
71
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
JA
50
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
JA
42
—
°C/W
1
Package Thermal Resistance, 28-pin QFN
JA
35
—
°C/W
1
Package Thermal Resistance, 36-pin VTLA
JA
31
—
°C/W
1
Package Thermal Resistance, 44-pin QFN
JA
32
—
°C/W
1
Package Thermal Resistance, 44-pin TQFP
JA
45
—
°C/W
1
Package Thermal Resistance, 44-pin VTLA
JA
30
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS61168E-page 244
Preliminary
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