IS75V16F128GS32 Datasheet, PDF (51/52 Pages) Integrated Silicon Solution, Inc – 3.0 Volt Multi-Chip Package (MCP) 128 Mbit Simultaneous Operation Flash Memory and 32 Mbit Pseudo Static RAM

IS75V16F128GS32
MINI BALL GRID ARRAY – 107-Ball BGA
PACKAGE CODE: B (9.00 mm x 10.00 mm Body, 0.8 mm Ball Pitch)
ISSI ^®
1 2 3 4 5 6 7 8 9 10
A
B
C
D
E
F
G
H
J
K
L
M
A1
A
SEATING PLANE
ø 0.40 + 0.10/−0.05 (107X)
10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
e
F
G
D1
H
J
D
K
L
M
e
E1
E
Symbol
A
A1
D
D1
E
E1
e
Min.
1.15
0.05
9.90
—
8.90
—
—
Typ.
1.25
0.10
10.00
8.80
9.00
7.20
0.80
Max.
1.40
0.15
10.10
—
9.10
—
—
Units
mm
mm
mm
mm
mm
mm
mm
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
51
PRELIMINARY INFORMATION Rev. 00D
03/24/03