MC9S12DP256B Datasheet, PDF (91/126 Pages) Freescale Semiconductor, Inc – device made up of standard HCS12 blocks and the HCS12 processor core

Freescale Semicon_Md_Cu₉c_S1t₂o_Dr_P,₂I₅n_6Bc_D._{evice User Guide — V02.15}
Table A-5 Thermal Package Characteristics¹
Num C
Rating
Symbol Min
Typ
1 T _{Thermal Resistance LQFP112, single sided PCB}²
θ_JA
-
-
Thermal Resistance LQFP112, double sided PCB
2 T _{with 2 internal planes3}
θ_JA
-
-
3 T Thermal Resistance LQFP 80, single sided PCB
θ_JA
-
-
4
T
Thermal Resistance LQFP 80, double sided PCB
with 2 internal planes
θ_JA
-
-
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
41
51
41
Unit
o_C/W
o_C/W
o_C/W
o_C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
93
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