MC9S08SH32CWL Datasheet, PDF (289/328 Pages) Freescale Semiconductor, Inc – MC9S08SH32 Series Features

Appendix A Electrical Characteristics
A.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P_I/O into account in power calculations, determine the difference between actual pin
voltage and V_SS or V_DD and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and V_SS or V_DD will be very small.
Table A-3. Thermal Characteristics
Num
1
2
3
4
C
Rating
Symbol
— Operating temperature range (packaged)
Temperature Code M
T_A
Temperature Code C
D Maximum junction temperature
T_J
D Thermal resistance, Single-layer board
16-pin TSSOP
θ_JA
20-pin TSSOP
28-pin SOIC
28-pin TSSOP
D Thermal resistance, Four-layer board
16-pin TSSOP
θ_JA
20-pin TSSOP
28-pin SOIC
28-pin TSSOP
Value
–40 to 125
–40 to 85
135
108
94
57
72
78
68
42
51
Unit
°C
°C
°C/W
°C/W
MC9S08SH32 Series Data Sheet, Rev. 2
Freescale Semiconductor
289
PRELIMINARY