K40P81M100SF2_11 Datasheet, PDF (2/63 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Table of Contents
1 Ordering parts...........................................................................3
6.1 Core modules....................................................................19
1.1 Determining valid orderable parts......................................3
6.1.1 Debug trace timing specifications.......................19
2 Part identification......................................................................3
6.1.2 JTAG electricals..................................................20
2.1 Description.........................................................................3
6.2 System modules................................................................23
2.2 Format...............................................................................3
6.3 Clock modules...................................................................23
2.3 Fields.................................................................................3
6.3.1 MCG specifications.............................................23
2.4 Example............................................................................4
6.3.2 Oscillator electrical specifications.......................26
3 Terminology and guidelines......................................................4
6.3.3 32kHz Oscillator Electrical Characteristics.........28
3.1 Definition: Operating requirement......................................4
6.4 Memories and memory interfaces.....................................28
3.2 Definition: Operating behavior...........................................5
6.4.1 Flash (FTFL) electrical specifications.................29
3.3 Definition: Attribute............................................................5
6.4.2 EzPort Switching Specifications.........................30
3.4 Definition: Rating...............................................................6
6.5 Security and integrity modules..........................................31
3.5 Result of exceeding a rating..............................................6
6.6 Analog...............................................................................31
3.6 Relationship between ratings and operating
6.6.1 ADC electrical specifications..............................31
requirements......................................................................6
6.6.2 CMP and 6-bit DAC electrical specifications......38
3.7 Guidelines for ratings and operating requirements............7
6.6.3 12-bit DAC electrical characteristics...................41
3.8 Definition: Typical value.....................................................7
6.6.4 Voltage reference electrical specifications..........44
3.9 Typical value conditions....................................................8
6.7 Timers................................................................................45
4 Ratings......................................................................................8
6.8 Communication interfaces.................................................45
4.1 Thermal handling ratings...................................................9
6.8.1 USB electrical specifications...............................46
4.2 Moisture handling ratings..................................................9
6.8.2 USB DCD electrical specifications......................46
4.3 ESD handling ratings.........................................................9
6.8.3 USB VREG electrical specifications...................46
4.4 Voltage and current operating ratings...............................9
6.8.4 CAN switching specifications..............................47
5 General.....................................................................................10
6.8.5 DSPI switching specifications (low-speed
5.1 Nonswitching electrical specifications...............................10
mode)..................................................................47
5.1.1 Voltage and current operating requirements......10
6.8.6 DSPI switching specifications (high-speed
5.1.2 LVD and POR operating requirements...............11
mode)..................................................................48
5.1.3 Voltage and current operating behaviors............12
6.8.7 I2C switching specifications................................50
5.1.4 Power mode transition operating behaviors.......12
6.8.8 UART switching specifications............................50
5.1.5 Power consumption operating behaviors............13
6.8.9 SDHC specifications...........................................50
5.1.6 EMC radiated emissions operating behaviors....16
6.8.10 I2S switching specifications................................51
5.1.7 Designing with radiated emissions in mind.........17
6.9 Human-machine interfaces (HMI)......................................53
5.1.8 Capacitance attributes........................................17
6.9.1 TSI electrical specifications................................53
5.2 Switching specifications.....................................................17
6.9.2 LCD electrical characteristics.............................54
5.2.1 Device clock specifications.................................17
7 Dimensions...............................................................................55
5.2.2 General switching specifications.........................18
7.1 Obtaining package dimensions.........................................55
5.3 Thermal specifications.......................................................18
8 Pinout........................................................................................56
5.3.1 Thermal operating requirements.........................18
8.1 K40 Signal Multiplexing and Pin Assignments..................56
5.3.2 Thermal attributes...............................................19
8.2 K40 Pinouts.......................................................................59
6 Peripheral operating requirements and behaviors....................19
9 Revision History........................................................................61
K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.