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K40P81M100SF2_11 Datasheet, PDF (17/63 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz
General
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/
Wideband TEM (GTEM) Cell Method.
2. VDD = 3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
5.1.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.1.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
CIN_A
CIN_D
Description
Input capacitance: analog pins
Input capacitance: digital pins
Min.
Max.
Unit
—
7
pF
—
7
pF
5.2 Switching specifications
5.2.1 Device clock specifications
Symbol
fSYS
fSYS_USB
fBUS
fFLASH
fSYS
fBUS
Description
System and core clock
Normal run mode
Min.
—
System and core clock when USB in operation
20
Bus clock
—
Flash clock
—
System and core clock
Bus clock
VLPR mode
—
—
Table continues on the next page...
Max.
100
—
50
25
2
2
Unit
MHz
MHz
MHz
MHz
MHz
MHz
K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
Notes
17