K40P81M100SF2_11 Datasheet, PDF (19/63 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Peripheral operating requirements and behaviors
5.3.2 Thermal attributes
Board
type
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Four-layer
(2s2p)
—
—
—
Symbol
R_θJA
R_θJA
R_θJMA
R_θJMA
R_θJB
R_θJC
Ψ_JT
Description
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
81 80 LQFP Unit
MAPBGA
TBD
TBD
°C/W
TBD
TBD
°C/W
TBD
TBD
°C/W
TBD
TBD
°C/W
TBD
TBD
TBD
TBD
TBD
TBD
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
1. output pins
• have C_L=30pF loads,
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
2. input pins
• have their passive filter disabled (PORTx_PCRn[PFE]=0)
6.1 Core modules
6.1.1 Debug trace timing specifications
Table 10. Debug trace operating behaviors
Symbol
T_cyc
Description
Clock period
Min.
Max.
Frequency dependent
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
Unit
MHz
19