900844 Datasheet, PDF (12/118 Pages) Freescale Semiconductor, Inc – Integrated Power Management IC for Ultra-mobile and Embedded Applications

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
POWER DISSIPATION
During operation, the temperature of the die must not exceed the maximum junction temperature. Depending on the operating
ambient temperature and the total internal dissipation this limit can be exceeded.
To optimize the thermal management scheme and avoid overheating, the 900844 provides a thermal management system
that protects against overheating. This protection should be considered as a fail-safe mechanism, and the application design
should initiate thermal shutdown under normal conditions. Reference Thermal Management for more details.
POWER CONSUMPTION
Table 2 defines the maximum power consumption specifications in the various system and device states. For each entry in
the table, the component is assumed to be configured for driving purely capacitive loads, and the voltages listed in each entry
are nominal output voltages.
Note that the “Soft Mechanical Off” state is a transitional state. The device will spend less than 150 µs in this state before V15
starts to turn on, upon detection of a valid input voltage.
900844
12
Analog Integrated Circuit Device Data
Freescale Semiconductor