900844 Datasheet, PDF (116/118 Pages) Freescale Semiconductor, Inc – Integrated Power Management IC for Ultra-mobile and Embedded Applications

PACKAGING
PACKAGE DIMENSIONS
PACKAGE MECHANICAL OUTLINE DRAWING
The package style is an 11x11 fine interstitial pitch, thin profile PBGA. The package has a semi populated matrix that includes
338 balls. The ball count includes 322 assigned signal pins and four sets of 4 corner balls.
PACKAGE ASSEMBLY RECOMMENDATIONS
For improved protection against mechanical shock, Freescale recommends applying corner glue to the mounted 900844
MAPBGA package. This corner glue application is described in the AN3954 - "PCB Layout Guidelines for SC900841 and
SCCSP900842" application note.
Freescale’s preferred material for the corner glue application is the Loctite 3128 board level adhesive, applied at a 0° or 45°
dispense angle in a continuous motion, and with the fillet length extended to a minimum of 3 ball rows and columns, at each
corner.
900844
116
Analog Integrated Circuit Device Data
Freescale Semiconductor