DS110RT410_15 Datasheet, PDF (6/60 Pages) Texas Instruments – Low-Power Multi-Rate Quad Channel Retimer

DS110RT410
SNLS460A – MAY 2013 – REVISED OCTOBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
V_DD
LVCMOS and Analog
SDA, SDC, INT
RXPn, RXNn
TXPn, TXNn
T_stg
Supply voltage
2.5 I/O voltage
3.3 LVCMOS I/O voltage
Signal input voltage
Signal output voltage
Junction temperature
Storage temperature
MIN
MAX
UNIT
–0.5
2.75
V
–0.5
2.75
V
–0.5
4.0
V
–0.5
2.75
V
–0.5
2.75
V
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
Machine model (MM), STD - JESD22-A115-A
VALUE
±6000
±1250
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Supply voltage (V_DD to GND)
Ambient temperature
MIN
2.375
–40
NOM
2.5
25
MAX
2.625
85
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DS110RT410
RHS (WQFN)
UNIT
48 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
29.2
°C/W
10.2
°C/W
6.1
°C/W
0.1
°C/W
6.1
°C/W
2.0
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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