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| TCA5013 Datasheet, PDF (59/68 Pages) Texas Instruments – Feature Rich Smartcard Interface IC | |||
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11.2 Layout Example
Top layer copper pour
Bottom layer copper pour
VIA to GND plane
TCA5013
SCPS253B â JANUARY 2014 â REVISED JANUARY 2016
VIA to VDD plane
VIA from top signal layer to bottom signal layer
Solder pad for device pin connection
10uH
10uF
VDD
GNDP
GNDP
LX
VUP
1uF
Figure 28. Example Layout of DC-DC Boost Section of TCA5013
Copyright © 2014â2016, Texas Instruments Incorporated
Product Folder Links: TCA5013
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