English
Language : 

TI380C25 Datasheet, PDF (56/71 Pages) Texas Instruments – TOKEN-RING COMMPROCESSOR
TI380C25
TOKEN-RING COMMPROCESSOR
SPWS012 – JANUARY 1995
68xxx DIO write-cycle timing
25-MHz OPERATION
33-MHz OPERATION
NO.
UNIT
MIN
MAX
MIN
MAX
255 Delay time, SDTACK low to either SCS, SUDS or SLDS high
15
15
ns
262
Setup time, write data valid before SUDS or SLDS no longer low
15
15
ns
263 Hold time, write data valid after SUDS or SLDS high
15
15
ns
267†
Setup time, register address before SUDS or SLDS no longer
high (see Note 19)
15
15
ns
268
Hold time, register address valid after SUDS or SLDS no longer
low (see Note 20)
0
0
ns
272
Setup time, SRNW before SUDS or SLDS no longer high
(see Note 19)
12
12
ns
272a
Setup time, inactive SUDS or SLDS high to active data strobe no
longer high
tc(SCK)
tc(SCK)
ns
273 Hold time, SRNW after SUDS or SLDS high
0
0
ns
273a
Hold time, inactive SUDS or SLDS high after active data strobe
high
tc(SCK)
tc(SCK)
ns
275
Delay time, SCS, SUDS or SLDS high to SDTACK high
(see Note 19)
0
25
0
25
ns
276‡
Delay time, SDTACK low in the first DIO access to the SIF register
to SDTACK low in the immediately following access to the SIF
4000
4000
ns
279§
Delay time, SUDS or SLDS high to SDTACK in the
high-impedance state
0
tc(SCK)
0
tc(SCK) ns
280
282b
Delay time, SUDS or SLDS low to SDDIR low (see Note 19)
Delay time, SDBEN low to SDTACK low
(see TMS380 Second Generation Token-
Ring User’s Guide, SPWU005, subsection
3.4.1.1.1)
If SIF register is
ready (no waiting
required)
If SIF register is
not ready (waiting
required)
0 tc(SCK) / 2 + 4
0 tc(SCK) / 2 + 4
0
4000
0 tc(SCK) / 2 + 4 ns
0 tc(SCK) / 2 + 4
ns
0
4000
282W Delay time, SDDIR low to SDBEN low
0 tc(SCK) / 2 + 4
0 tc(SCK) / 2 + 4 ns
283W Delay time, SUDS or SLDS high to SDBEN no longer low
0 tc(SCK) / 2 + 4
0 tc(SCK) / 2 + 4 ns
286
Pulse duration, SUDS or SLDS high between DIO accesses
(see Note 19)
tc(SCK)
tc(SCK)
ns
† It is the later of SRD and SWR or SCS low that indicates the start of the cycle.
‡ This specification has been characterized to meet stated value. It is not assured during manufacturing testing.
§ This specification is provided as an aid to board design. It is not assured during manufacturing testing.
NOTES: 19. The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt-acknowledge
cycles.
20. In 80x8x mode, SRAS may be used to strobe the values of SBHE, SRSX, SRS0 – SRS2, and SCS. When used to do so, SRAS must
meet parameter 266a, and SBHE, SRS0 – SRS2, and SCS must meet parameter 264. If SRAS is strapped high, parameters 266a
and 264 are irrelevant and parameter 268 must be met.
56
• POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443