DRV8320_17 Datasheet, PDF (10/89 Pages) Texas Instruments – 6 to 60-V Three-Phase Smart Gate Driver

DRV8320, DRV8320R
DRV8323, DRV8323R
SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
www.ti.com
7.3 Recommended Operating Conditions
at T_A = –40°C to +125°C (unless otherwise noted)
GATE DRIVER
V_VM
Power supply voltage (VM)
V_I
Input voltage (CAL, ENABLE, GAIN, IDRIVE, INHx, INLx, MODE, nSCS,
SCLK, SDI, VDS)
f_PWM
Applied PWM signal (INHx, INLx)
I_{GATE_HS}
High-side average gate-drive current (GHx)
I_{GATE_LS}
Low-side average gate-drive current (GLx)
I_DVDD
External load current (DVDD)
V_VREF
Reference voltage input (VREF)
I_SO
Shunt amplifier output current (SOx)
V_OD
Open drain pullup voltage (nFAULT, SDO)
I_OD
Open drain output current (nFAULT, SDO)
BUCK REGULATOR
V_VIN
V_nSHDN
DRV832x
Power supply voltage (VIN)
Shutdown control input voltage (nSHDN)
T_A
Operating ambient temperature
(1) Power dissipation and thermal limits must be observed
MIN
MAX
UNIT
6
60
V
0
5.5
V
0
200 ⁽¹⁾
kHz
0
25 ⁽¹⁾
mA
0
25 ⁽¹⁾
mA
0
30 ⁽¹⁾
mA
3
5.5
V
0
5
mA
0
5.5
V
0
5
mA
4
60
V
0
60
V
–40
125
°C
7.4 Thermal Information
DRV832x
THERMAL METRIC⁽¹⁾
RTV
(WQFN)
RHA
(VQFN)
RTA
(WQFN)
RGZ
(VQFN)
UNIT
32 PINS 40 PINS 40 PINS 48 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
32.9
30.1
32.1
15.8
16.7
11
6.8
9.9
7.1
0.2
0.5
0.1
6.8
9.9
7.1
2.1
2.2
2.1
26.6
°C/W
13.9
°C/W
9.2
°C/W
0.3
°C/W
9.1
°C/W
2
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
10
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