TL16C750 Datasheet, PDF (34/35 Pages) Texas Instruments – ASYNCHRONOUS COMMUNICATIONS ELEMENT WITH 64-BYTE FIFOs AND AUTOFLOW CONTROL

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PACKAGE OPTION ADDENDUM
24-Jun-2005
PACKAGING INFORMATION
Orderable Device
TL16C750FN
TL16C750FNR
TL16C750IPM
TL16C750PM
TL16C750Y
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
Package
Type
PLCC
PLCC
LQFP
Package
Drawing
FN
FN
PM
ACTIVE
LQFP
PM
OBSOLETE XCEPT
Y
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
44 26
TBD
CU
Level-3-220C-168 HR
44 500
TBD
CU
Level-3-220C-168 HR
64 160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
64 160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
0
TBD
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1