LSM9DS1 Datasheet, PDF (69/72 Pages) –

LSM9DS1
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
9.1
Soldering information
The LGA package is compliant with the ECOPACK^®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
9.2
LGA package information
Figure 31. LGA (3.5x3x1 mm) 24-lead package outline
DocID025715 Rev 3
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