LSM9DS1 Datasheet, PDF (27/72 Pages) –

LSM9DS1
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Application hints
Application hints
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Figure 15. LSM9DS1 electrical connections
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4.1
External capacitors
The device core is supplied through the Vdd line. Power supply decoupling capacitors (C2,
C3 = 100 nF ceramic, C4 = 10 µF Al) should be placed as near as possible to the supply pin
of the device (common design practice). Capacitor C1 (100 nF) should be a capacitor with
low ESR value and should be placed as near as possible to the C1 pin.
All voltage and ground supplies must be present at the same time to achieve proper
behavior of the IC (refer to Figure 15).
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