SP37E760 Datasheet, PDF (76/78 Pages) SMSC Corporation – 3.3 V I/O CONTROLLER FOR EMBEDDED APPLICATIONS

10 PACKAGE OUTLINES
D
D
1
E
E1
e
W
A
A2
H
0 .1
-0
A1
C-
D IM
A
A1
A2
D
D1
E
E1
H
L
L1
e
0
W
TD (1
)
TE(1 )
TD (2
)
TE(2 )
M IN
MA X
2 .8 0
3 .1 5
0 .1
0 .4 5
2 .5 7
2 .8 7
2 3.4
24 .1 5
1 9.9
20 .1
1 7.4
18 .1 5
1 3.9
14 .1
0 .1
0 .2
0 .6 5
0 .9 5
1 .8
2 .6
0 .6 5 BSC
0°
12°
.2
.4
2 1.8
22 .2
1 5.8
16 .2
22 .2 1
22 .7 6
16 .2 7
16 .8 2
TD /
TE
M IN
MA X
.11 0
.1 24
.00 4
.0 18
.10 1
.1 13
.92 1
.9 51
.78 3
.7 91
.68 5
.7 15
.54 7
.5 55
.00 4
.0 08
.02 6
.0 37
.07 1
.1 02
.02 56 BSC
0°
12°
.00 8
.01 6
.85 8
.87 4
.62 2
.63 8
.87 4
.89 6
.64 1
.66 2
0
L
L
1
N otes :
1 ) C op la na rity is 0 .1 00 mm (.00 4") max imu m.
2 ) To le ran c e o n th e po s ition o f th e le ad s is
0 .2 00 mm (.00 8") max imu m.
3 ) Pa c k ag e bo dy d ime ns io ns D 1 a nd E1 do n ot
inc lu de the mo ld p rotrus io n. Max imu m mo ld
pro tru s ion is 0.25 mm (.01 0").
4) D imen s ion s TD an d TE a re imp ortan t fo r tes ting
by ro bo tic ha nd le r. On ly a bo v e c omb in atio ns o f (1)
or (2) are a c c ep ta ble.
5) C oinntinroclhlinegs dfoimr erenfse iroenn:cme ilolimnley tearn.dDnimo _te ns io ns
ac c u rate.
ne c e s s arily
FIGURE 17 – 100 PIN QFP
SMSC DS – SP37E760
Page 76
Rev. 04/13/2001