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HYB18L256160B Datasheet, PDF (50/58 Pages) Qimonda AG – DRAMs for Mobile Applications 256-Mbit Mobile-RAM
Data Sheet
HY[B/E]18L256160B[C/F]L-7.5
256-Mbit Mobile-RAM
Parameter
Symbol
- 7.5
Unit Note1)2)3)4)
min.
max.
DQM write mask latency
tDQW
0
—
tCK
—
ACTIVE to ACTIVE command period
tRC
67
—
ns
8)
ACTIVE to READ or WRITE delay
tRCD
19
—
ns
8)
ACTIVE bank A to ACTIVE bank B delay
tRRD
15
—
ns
8)
ACTIVE to PRECHARGE command period
tRAS
45
100k
ns
8)
WRITE recovery time
tWR
14
—
ns
9)
PRECHARGE command period
tRP
19
—
ns
8)
Refresh period (8192 rows)
tREF
—
64
ms —
Self refresh exit time
tSREX
1
—
tCK
—
1) 0 °C ≤ TC ≤ 70 °C (comm.); -25 °C ≤ TC ≤ 85 °C (ext.); VDD = VDDQ = 1.65V to 1.95V;
2) All parameters assumes proper device initialization.
3) AC timing tests measured at 0.9 V.
4) The transition time tT is measured between VIH and VIL; all AC characteristics assume tT = 1 ns.
5) Specified tAC and tOH parameters are measured with a 30 pF capacity load only as shown in Figure 47.
6) If tT(CLK) > 1 ns, a value of (tT/2 - 0.5) ns has to be added to this parameter.
7) If tT > 1 ns, a value of (tT - 1) ns has to be added to this parameter.
8) These parameter account for the number of clock cycles and depend on the operating frequency, as follows:
no. of clock cycles = specified delay / clock period; round up to next integer.
9) The write recovery time of tWR = 14 ns allows the use of one clock cycle for the write recovery time when fCK ≤ 72 MHz. With fCK > 72 MHz
two clock cycles for tWR are mandatory. Qimonda Technologies recommends to use two clock cycles for the write recovery time in all
applications.
FIGURE 47
Measurement Conditions for tAC and tOH
I/O
30 pF
Rev. 1.73, 2006-09
50
01302004-CZ2R-J9SE