MT9M114_16 Datasheet, PDF (8/62 Pages) ON Semiconductor – High-Definition (HD) System-On- A-Chip (SOC) Digital Image Sensor

MT9M114: 1/6-Inch 720p High-Definition (HD) System-On-A-Chip (SOC) Dig-
ital Image Sensor
Decoupling Capacitor Recommendations
It is important to provide clean, well regulated power to each power supply. The ON
Semiconductor recommendation for capacitor placement and values are based on our
internal demo camera design and verified in hardware. Note: Because hardware design
is influenced by many factors, such as layout, operating conditions, and component
selection, the customer is ultimately responsible to ensure that clean power is provided
for their own designs.
In order of preference, ON Semiconductor recommends:
1. Mount 0.1F and 1F decoupling capacitors for each power supply as close as possi-
ble to the pad and place a 10F capacitor nearby off-module.
2. If module limitations allow for only six decoupling capacitors for a three-regulator
design use a 0.1F and 1F capacitor for each of the three regulated supplies. ON
Semiconductor also recommends placing a 10F capacitor for each supply off-mod-
ule, but close to each supply.
3. If module limitations allow for only three decoupling capacitors, use a 1F capacitor
(preferred) or a 0.1F capacitor for each of the three regulated supplies. ON Semicon-
ductor recommends placing a 10F capacitor for each supply off-module but close to
each supply.
4. Give priority to the VAA supply for additional decoupling capacitors.
5. Inductive filtering components are not recommended.
6. Follow best practices when performing physical layout. Refer to technical note
TN-09-131.
Output Data Format
The MT9M114 image data is read out in a progressive scan. Valid image data is
surrounded by horizontal blanking and vertical blanking, as shown in Figure 3.
LINE_VALID is HIGH in the shaded region of the figure.
Figure 3: Spatial Illustration of Image Readout
MT9M114/D Rev. 11, 2/16 EN
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©Semiconductor Components Industries, LLC,2016.