MT9M114_16 Datasheet, PDF (60/62 Pages) ON Semiconductor – High-Definition (HD) System-On- A-Chip (SOC) Digital Image Sensor

MT9M114: 1/6-Inch 720p High-Definition (HD) System-On-A-Chip (SOC) Dig-
ital Image Sensor
Package Dimensions
Table 31: Package Dimensions
Nominal
Min
Parameter
Symbol
Package Body Dimension X
A
Package Body Dimension Y
B
Package Height
C
Cavity height (glass to pixel
C4
distance)
Glass Thickness
C3
Package Body Thickness
C2
Ball Height
C1
Ball Diameter
D
Total Ball Count
N
Ball Count X axis
N1
Ball Count Yaxis
N2
UBM
U
Pins Pitch X axis
J1
Pins Pitch Y axis
J2
BGA ball center to package center
X
offset in X-direction
BGA ball center to package center
Y
offset in Y-direction
Edge to Ball Center Distance along X S1
Edge to Ball Center Distance along Y S2
4.648
3.848
0.690
0.041
0.400
0.570
0.120
0.230
55
8
7
0.240
0.520
0.520
0.000
0.000
0.504
0.364
Millimeters
4.623
3.823
0.635
0.037
0.390
0.535
0.090
0.200
0.230
–0.025
–0.025
0.474
0.334
Note: Package center = die center.
Max
4.673
3.873
0.745
0.045
0.410
0.605
0.150
0.260
0.250
0.025
0.025
0.534
0.394
Nominal
0.183
0.151
0.027
0.002
0.016
0.022
0.005
0.009
Min
Inches
0.182
0.151
0.025
0.001
0.015
0.021
0.004
0.008
0.009
0.009
0.000
0.000
0.020
0.014
–0.001
–0.001
0.019
0.013
Max
0.184
0.152
0.029
0.002
0.016
0.024
0.006
0.010
0.010
0.001
0.001
0.021
0.016
MT9M114/D Rev. 11, 2/16 EN
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©Semiconductor Components Industries, LLC,2016.