MT9M114_16 Datasheet, PDF (7/62 Pages) ON Semiconductor – High-Definition (HD) System-On- A-Chip (SOC) Digital Image Sensor

MT9M114: 1/6-Inch 720p High-Definition (HD) System-On-A-Chip (SOC) Dig-
ital Image Sensor
Table 3: Pin Descriptions
Name
EXTCLK
RESET_BAR
OE_BAR
SCLK
SDATA
SADDR
FRAME_VALID (FV)
LINE_VALID (LV)
PIXCLK
DOUT[7:0]
DOUT_LSB[1:0]
CLK_N
CLK_P
DATA_N
DATA_P
CONFIG
FLASH
CHAIN
TRST_BAR
VDD
DGND
VDD_IO
GND_IO
VAA
AGND
VDD_PLL
GND_PLL
VDD_PHY
Notes:
Type
Input
Input/PU
Input
Input
I/O
Input
Output
Output
Output
Output
Output
Output
Output
Output
Output
Input/PU
Output
Output/PU
Input
Supply
Supply
Supply
Supply
Supply
Supply
Supply
Supply
Supply
Description
Input clock signal.
Master reset signal, active LOW. This signal has an internal pull up.
Parallel interface enable pad, active LOW.
Two-wire serial interface clock.
Two-wire serial interface data.
Selects device address for the two-wire serial interface.
Identifies rows in the active image. Data can be sampled with PIXCLK when
both LV and FV are high (except when BT656 is used).
Identifies pixels in the active line. Data can be sampled with PIXCLK when
both LV and FV are high (except when BT656 is used).
Pixel clock.
DOUT[7:0] for 8-bit image data output or DOUT[9:2] for 10-bit image data
output.
LSBs when outputting 10-bit image data
Differential MIPI clock (sub-LVDS, negative).
Differential MIPI clock (sub-LVDS, positive).
Differential MIPI data (sub-LVDS, negative.
Differential MIPI data (sub-LVDS, positive).
If on power-up CONFIG = 1 then the part shall go into streaming (default
option, PU ensures this will occur). If CONFIG = 0 then the part will go to
standby state waiting for host to update.
Used as a flash signal
To synchronize a number of sensors together.
Must be tied to GND in normal operation.
Digital Power
Digital ground.
I/O power supply.
I/O ground.
Analog power.
Analog ground.
PLL Supply
PLL GND
I/O power supply for the MIPI interface.
Notes
2
2
2
2
4
2
2
1
1
3
1. AGND and DGND are not connected internally.
2. To be left floating if not using feature. If not using the feature, then there is no need to bond out the
relevant pads.
3. Must always be connected even when not using MIPI.
4. When CONFIG = 1 the EXTCLK must be in the range 20-24 MHz.
MT9M114/D Rev. 11, 2/16 EN
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