MT9M114_16 Datasheet, PDF (6/62 Pages) ON Semiconductor – High-Definition (HD) System-On- A-Chip (SOC) Digital Image Sensor

MT9M114: 1/6-Inch 720p High-Definition (HD) System-On-A-Chip (SOC) Dig-
ital Image Sensor
Figure 2: Typical Configuration
I/O⁵
power
PHY²
power
Digital
PLL core Analog
power power power
R_PULL-UP4
Two-wire
serial interface
Active LOW reset
External clock in
(6–54 MHz)
Active HIGH Default settings
VDD_IO VDD_PHY VDD_PLL ^VDD VAA
SADDR
SDATA
SCLK
RESET_BAR⁶
EXTCLK
CONFIG⁶
TRST_BAR⁸
OE_BAR⁹
DGND
DOUT[7:0]
PIXCLK
LINE_VALID
FRAME_VALID
DATA_N
DATA_P
CLK_N
CLK_P
GND_PLL AGND
Parallel
Port
OR³
MIPI
Serial
Port
VDD_IO^{5, 7}
VDD_PHY^{2, 7}
VDD_PLL⁷
VDD7
VAA7
Notes:
1. This typical configuration shows only one scenario out of multiple possible variations for this sen-
sor.
2. If a MIPI Interface is not required, the following signals must be left floating: DATA_P, DATA_N,
CLK_P, and CLK_N. The VDD_PHY power signal must always be connected to the 1.8V supply.
3. Only one of the output modes (serial or parallel) can be used at any time.
4. ON Semiconductor recommends a 1.5kresistor value for the two-wire serial interface RPULL-UP;
however, greater values may be used for slower transmission speed.
5. All inputs must be configured with VDD_IO.
6. RESET_BAR and CONFIG both have internal pull-up resistors and can be left floating.
7. ON Semiconductor recommends that 0.1F and 1F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and numbers may vary depending on
layout and design considerations.
8. TRST_BAR connects to GND for normal operation.
9. OE_BAR should be connected HIGH when using MIPI interface.
MT9M114/D Rev. 11, 2/16 EN
6
©Semiconductor Components Industries, LLC,2016.