MC68HC05C8A Datasheet, PDF (137/158 Pages) Motorola, Inc – Microcontrollers

Technical Data — MC68HC05C8A • MC68HCL05C8A • MC68HSC05C8A
Section 14. Mechanical Specifications
14.1 Contents
14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
14.3 40-Pin Plastic Dual In-Line (DIP)
Package (Case 711-03). . . . . . . . . . . . . . . . . . . . . . . . . . .138
14.4 42-Pin Plastic Shrink Dual In-Line (SDIP)
Package (Case 858-01). . . . . . . . . . . . . . . . . . . . . . . . . . .138
14.5 44-Lead Plastic Leaded Chip
Carrier (PLCC) (Case 777-02). . . . . . . . . . . . . . . . . . . . . . 139
14.6 44-Lead Quad Flat Pack (QFP)
(Case 824A-01) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
14.2 Introduction
This section describes the dimensions of the:
• Dual in-line package (DIP)
• Plastic shrink dual in-line package (SDIP)
• Plastic leaded chip carrier (PLCC)
• Quad flat pack (QFP) MCU packages
MC68HC05C8A • MC68HCL05C8A • MC68HSC05C8A — Rev. 5.0
MOTOROLA
Mechanical Specifications
Technical Data
137