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82596DX Datasheet, PDF (60/77 Pages) Intel Corporation – HIGH-PERFORMANCE 32-BIT LOCAL AREA NETWORK COPROCESSOR
82596DX SX
PGA PACKAGE THERMAL
SPECIFICATION
Parameter
Thermal Resistance
iJC
3C W
iJA
24 C W
ELECTRICAL AND TIMING
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
b65 C to a150 C
Case Temperature under Bias b65 C to a110 C
Supply Voltage
with Respect to VSS
Voltage on Other Pins
b0 5V to a6 5V
b0 5V to VCC a 0 5V
D C CHARACTERISTICS
TC e 0 C to a85 C VCC e 5V g10% CLK2 and LE BE have MOS levels (see VMIL VMIH)
All other signals have TTL levels (see VIL VIH VOL VOH)
Symbol
Parameter
Min
Max
Units
Notes
VIL
VIH
VMIL
VMIH
VOL
VCIL
VCIH
VOH
ILI
ILO
CIN
COUT
Input Low Voltage (TTL)
b0 3
a0 8
V
Input High Voltage (TTL)
Input Low Voltage (MOS)
20
VCC a 0 3
V
b0 3
a0 8
V
Input High Voltage (MOS)
37
VCC a 0 3
V
Output Low Voltage (TTL)
0 45
V
IOL e 4 0 mA
RxC TxC Input Low Voltage b0 5
06
V
RxC TxC Input High Voltage
33
VCC a 0 5
V
Output High Voltage (TTL)
24
V
IOH e 0 9mA – 1 mA
Input Leakage Current
g15
mA
0 s VIN s VCC
Output Leakage Current
g15
mA
0 45 k VOUT k VCC
Capacitance of Input Buffer
10
pF
FC e 1 MHz
Capacitance of Input Output
Buffer
12
pF
FC e 1 MHz
CCLK
ICC
ICC
ICC
CLK Capacitance
Power Supply
Power Supply
Power Supply
20
pF
FC e 1 MHz
150
mA
At 20 MHz
for the 82596SX
ICC Typical e 90 mA
200
mA
At 25 MHz
ICC Typical e 100 mA
300
mA
At 33 MHz
ICC Typical e 150 mA
60