TLE9263-3QX Datasheet, PDF (196/198 Pages) Infineon Technologies AG – Dedicated Data Sheets are available for the different product variants

18
Package Outlines
TLE9263-3QX
Package Outlines
7 ±0.1
6.8
A
B
+0.03 ¹⁾
48x
0.08
0.9 MAX.
(0.65)
0.1±0.03
11 x 0.5 = 5.5
0.5
25
24
36 ²⁾
37
Index Marking
0.4 x 45°
(0.2)
C 0.05 MAX.
1) Vertical burr 0.03 max., all sides
2) This four metal areas have exposed diepad potential
13
12
(0.35)
48
0.23 ±0.05
(5.2)
(6)
1 _{Index Marking}
48x
0.1 M A B C
PG-VQFN-48-29, -31-PO V03
Figure 69 PG-VQFN-48-31
Note: For assembly recommendations please also refer to the documents "Recommendations for Board Assembly
(VQFN and IQFN)" and "VQFN48 Layout Hints" on the Infineon website (www.infineon.com).
The PG-VQFN-48-31 package is a leadless exposed pad power package featuring Lead Tip Inspection (LTI) to
support Automatic Optical Inspection (AOI).
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
196
Dimensions in mm
Rev. 1.1, 2014-09-26