MC68HC05C8A Datasheet, PDF (99/116 Pages) Motorola, Inc – Microcontrollers

Chapter 14
Mechanical Specifications
14.1 Introduction
This section describes the dimensions of the:
• Dual in-line package (DIP)
• Plastic shrink dual in-line package (SDIP)
• Plastic leaded chip carrier (PLCC)
• Quad flat pack (QFP) MCU packages
14.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
40
1
H
A
G
F
21
B
20
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 51.69 52.45
B 13.72 14.22
C 3.94 5.08
D 0.36 0.56
F 1.02 1.52
G
2.54 BSC
H 1.65 2.16
J 0.20 0.38
K 2.92 3.43
L
15.24 BSC
M
0°
1°
N 0.51 1.02
INCHES
MIN MAX
2.035 2.065
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0°
1°
0.020 0.040
MC68HC05C8A • MC68HCL05C8A • MC68HSC05C8A Data Sheet, Rev. 5.1
Freescale Semiconductor
99