PXR40 Datasheet, PDF (53/100 Pages) Freescale Semiconductor, Inc – PXR40 Microcontroller

Electrical characteristics
1 _{Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,}
and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or
cause permanent damage to the device.
2 _{2.0 V for 10 hours cumulative time, 1.32 V +10% for time remaining.}
3 _{6.4 V for 10 hours cumulative time, 5.25 V +10% for time remaining.}
4 _{Voltage overshoots during a high-to-low or low-to-high transition must not exceed 10 seconds per instance.}
5 _{5.3 V for 10 hours cumulative time, 3.60 V +10% for time remaining.}
6 _{PXR40 has two analog power supply pins on the pinout: VDDA_A and VDDA_B.}
7 _{PXR40 has two analog ground supply pins on the pinout: VSSA_A and VSSA_B.}
8 _{PXR40 has two analog low reference voltage pins on the pinout: VRL_A and VRL_B.}
9 _{PXR40 has two analog high reference voltage pins on the pinout: VRH_A and VRH_B.}
10 _{Total injection current for all pins must not exceed 25 mA at maximum operating voltage.}
11 _{Injection current of ±5 mA allowed for limited duration for analog (ADC) pads and digital 5 V pads. The maximum accumulated}
time at this current shall be 60 hours. This includes an assumption of a 5.25 V maximum analog or V_DDEH supply when under
this stress condition.
12 _{Total injection current for all analog input pins must not exceed 15 mA.}
13 _{Lifetime operation at these specification limits is not guaranteed.}
14 _{Solder profile per CDF-AEC-Q100.}
15 _{Moisture sensitivity per JEDEC test method A112.}
5.2
Thermal characteristics
Table 4. Thermal characteristics, 416-pin TEPBGA package¹
Characteristic
Symbol Value
Unit
Junction to Ambient ^2,3 Natural Convection (Single layer board)
Junction to Ambient ^2,4 Natural Convection (Four layer board 2s2p)
R_JA
R_JA
24
°C/W
18
°C/W
Junction to Ambient (@200 ft./min., Single layer board)
R_JMA
19
°C/W
Junction to Ambient (@200 ft./min., Four layer board 2s2p)
R_JMA
14
°C/W
Junction to Board ⁵
R_JB
9
°C/W
Junction to Case ⁶
R_JC
6
°C/W
Junction to Package Top ⁷ Natural Convection
_JT
2
°C/W
1 _{Thermal characteristics are targets based on simulation that are subject to change per device}
characterization. This data is PRELIMINARY based on similar package used on other devices.
2 _{Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting}
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
3 _{Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.}
4 _{Per JEDEC JESD51-6 with the board horizontal.}
5 _{Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board}
temperature is measured on the top surface of the board near the package.
6 _{Indicates the average thermal resistance between the die and the case top surface as measured by the}
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
7 _{Thermal characterization parameter indicating the temperature difference between package top and the}
junction temperature per JEDEC JESD51-2.
PXR40 Microcontroller Data Sheet, Rev. 1
Freescale Semiconductor
53