MC9328MXS Datasheet, PDF (70/72 Pages) List of Unclassifed Manufacturers – Advance Information

Pin-Out and Package Information
4.1 PBGA 225 Package Dimensions
Figure 57 illustrates the 225 PBGA 13 mm × 13 mm package.
Case Outline 1304B
TOP VIEW
NOTES:
BOTTOM VIEW
SIDE VIEW
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONS AND TOLERANCES PER ASME Y14 5M-1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE IS DEFINED BY SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
Figure 57. i.MX Processor’s 225 PBGA Mechanical Drawing
MC9328MXS Advance Information, Rev. 0
70
Freescale Semiconductor