BCM4339XKWBGT Datasheet, PDF (176/183 Pages) Cypress Semiconductor – Single-Chip 5G WiFi IEEE 802.11ac MAC/Baseband/Radio with Integrated Bluetooth 4.1 and FM Receiver

BCM4339 Preliminary Data Sheet
Package Information
Section 22: Package Information
Package Thermal Characteristics
Table 63: Package Thermal Characteristics^a
Characteristic
FCFBGA
WLBGA
WLCSP
_JA (°C/W) (value in still air)
_JB (°C/W)
_JC (°C/W)
_JT (°C/W)
_JB (°C/W)
Maximum Junction Temperature T_j (°C)
Maximum Power Dissipation (W)
48.03
17.01
24.52
10.78
18.02
125
1.41
32.9
2.56
0.98
3.30
9.85
125
1.119
33.45
3.45
1.00
3.45
10.64
125
1.119
a. No heat sink, TA = 70°C. This is an estimate, based on a 4-layer PCB that conforms to EIA/JESD51–7
(101.6 mm × 101.6 mm × 1.6 mm) and P = specified power maximum continuous power dissipation.
Junction Temperature Estimation and PSI_JT Versus THETA_JC
Package thermal characterization parameter PSI–J_T (_JT) yields a better estimation of actual junction
temperature (T_J) versus using the junction-to-case thermal resistance parameter Theta–J_C (_JC). The reason
for this is that _JC assumes that all the power is dissipated through the top surface of the package case. In actual
applications, some of the power is dissipated through the bottom and sides of the package. _JT takes into
account power dissipated through the top, bottom, and sides of the package. The equation for calculating the
device junction temperature is:
T_J = T_T + P x _JT
Where:
• T_J = Junction temperature at steady-state condition (°C)
• T_T = Package case top center temperature at steady-state condition (°C)
• P = Device power dissipation (Watts)
• _JT = Package thermal characteristics; no airflow (°C/W)
Environmental Characteristics
For environmental characteristics data, see Table 31: “Environmental Ratings,” on page 123.
Broadcom^®
November 17, 2014 • 4339-DS106-R
Page 175