W25Q256FVBIF-TR Datasheet, PDF (76/108 Pages) Winbond – 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q256FV
8.2.35 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 39. The Device ID values for the W25Q256FV are listed in Manufacturer and Device
Identification table. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO₀)
DO
(IO₁)
/CS
CLK
Mode 3
Mode 0
0 1 2 3 4 5 6 7 8 9 10
28 29 30 31
Instruction (90h)
Address (000000h)
23 22 21
*
High Impedance
3210
* ^{= MSB}
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46
Mode 3
Mode 0
DI
(IO₀)
0
DO
(IO₁)
Manufacturer ID (EFh)
76543210
*
Device ID
Figure 39. Read Manufacturer / Device ID Instruction (SPI Mode)
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