W25Q256FVBIF-TR Datasheet, PDF (7/108 Pages) Winbond – 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q256FV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q256FV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package
code F) and two 24-ball 8x6-mm TFBGA (package code B & C) packages as shown in Figure 1a-c
respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pad Configuration WSON 8x6-mm
Top View
/CS
DO (IO₁)
/WP (IO₂)
18
27
36
VCC
/HOLD or /RESET
(IO₃)
CLK
GND
45
DI (IO₀)
Figure 1a. W25Q256FV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)
3.2 Pad Description WSON 8x6-mm
PAD NO.
PAD NAME
I/O
FUNCTION
1
/CS
I
Chip Select Input
2
DO (IO1)
I/O
Data Output (Data Input Output 1)⁽¹⁾
3
/WP (IO2)
I/O
Write Protect Input ( Data Input Output 2)⁽²⁾
4
GND
Ground
5
DI (IO0)
I/O
Data Input (Data Input Output 0)⁽¹⁾
6
CLK
I
Serial Clock Input
7
/HOLD or /RESET
(IO3)
I/O
Hold or Reset Input (Data Input Output 3)⁽²⁾
8
VCC
Power Supply
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
Publication Release Date: February 11, 2015
-6-
Preliminary – Revision H