W25Q256FVBIF-TR Datasheet, PDF (5/108 Pages) Winbond – 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q256FV
9.9 HOLD Timing...................................................................................................................... 99
9.10 WP Timing .......................................................................................................................... 99
10. PACKAGE SPECIFICATIONS ..................................................................................................... 100
10.1 8-Pad WSON 8x6-mm (Package Code E) ....................................................................... 100
10.2 16-Pin SOIC 300-mil (Package Code F) .......................................................................... 102
10.3 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array)......................................... 103
10.4 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) ............................................ 104
11. ORDERING INFORMATION ........................................................................................................ 105
11.1 Valid Part Numbers and Top Side Marking ...................................................................... 106
12. REVISION HISTORY.................................................................................................................... 107
Publication Release Date: February 11, 2015
-4-
Preliminary – Revision H