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W83627THF_06 Datasheet, PDF (28/142 Pages) Winbond – Winbond LPC I/O
W83627THF/W83627THG
5. HARDWARE MONITOR
5.1 General Description
The W83627THF can be used to monitor several critical hardware parameters of the system, including
power supply voltages, fan speeds, and temperatures, which are very important for a high-end
computer system to work stable and properly. W83627THF provides LPC interface to access
hardware .
An 8-bit analog-to-digital converter (ADC) was built inside W83627THF. The W83627THF can
simultaneously monitor 3 analog voltage inputs (addition monitor VBAT, 5VSB & 5VCC power), 3 fan
tachometer inputs, 3 remote temperature inputs and one case-open detection signal. The remote
temperature sensing can be performed by thermistors, 2N3904 NPN-type transistors, or directly from
IntelTM CPU thermal diode output. Also the W83627THF provides: 3 analog outputs for fan speed
control. Beep tone output for warning; SMI#(can through SERIRQ pin), OVT# signals for system
protection events.
Through the application software or BIOS, the users can read all the monitored parameters of system
from time to time. And a pop-up warning can be also activated when the monitored item was out of
the proper/preset range. The application software could be Winbond's Hardware DoctorTM, or IntelTM
LDCM (LanDesk Client Management), or other management application software. Also the users
can set up the upper and lower limits (alarm thresholds) of these monitored parameters and to activate
one programmable and maskable interrupts. An optional beep tone could be used as warning signal
when the monitored parameters are out of the preset range.
5.2 Access Interface
W83627THF uses LPC Bus to access which the ports address of low byte (bit2~bit0) are defined in
the port 5h and 6h. The other higher bits of these ports are set by W83627THF itself. The general
decoded address is set to port 295h and port 296h. These two ports are described as following:
Port 295h: Index port.
Port 296h: Data port.
The register structure is showed as the Figure 5-1
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Publication Release Date: September 26, 2006
Revision 1.2