W83627THF_06 Datasheet, PDF (117/142 Pages) Winbond – Winbond LPC I/O

W83627THF/W83627THG
11. PACKAGE DIMENSIONS
(128-pin QFP)
102
103
HE
E
65
64
D HD
128
1
e
b
See Detail F
Seating Plane
39
38
A
A2
A1
y
c
L
L1
Detail F
Symbol
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Min
0.25
2.57
0.10
0.10
13.90
19.90
17.00
23.00
0.65
0
Dimension in mm
Nom
Max
0.35
0.45
2.72
2.87
0.20
0.30
0.15
0.20
14.00
14.10
20.00
0.50
20.10
17.20
23.20
0.80
17.40
23.40
0.95
1.60
0.08
7
Dimension in inch
Min Nom Max
0.010 0.014 0.018
0.101 0.107 0.113
0.004 0.008 0.012
0.004 0.006 0.008
0.547 0.551 0.555
0.783 0.787 0.791
0.020
0.669 0.677 0.685
0.905 0.913 0.921
0.025 0.031 0.037
0.063
0.003
0
7
Note:
1.Dimension D & E do not include interlead
flash.
2.Dimension b does not include dambar
protrusion/intrusion .
3.Controlling dimension : Millimeter
4.General appearance spec. should be based
on final visual inspection spec.
5. PCB layout please use the "mm".
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