DS90UH926QSQE Datasheet, PDF (49/56 Pages) Texas Instruments – DS90UH926Q 720p 24-bit Color FPD-Link III Deserializer with HDCP

DS90UH926Q
www.ti.com
SNLS337J – OCTOBER 2010 – REVISED APRIL 2013
TRANSMISSION MEDIA
The DS90UH925Q and DS90UH926Q chipset is intended to be used in a point-to-point configuration through a
shielded twisted pair cable. The serializer and deserializer provide internal termination to minimize impedance
discontinuities. The interconnect (cable and connector) between the serializer and deserializer should have a
differential impedance of 100 Ω. The maximum length of cable that can be used is dependant on the quality of
the cable (gauge, impedance), connector, board (discontinuities, power plane), the electrical environment (e.g.
power stability, ground noise, input clock jitter, PCLK frequency, etc.) and the application environment.
The resulting signal quality at the receiving end of the transmission media may be assessed by monitoring the
differential eye opening of the serial data stream. The Receiver CML Monitor Driver Output Specifications define
the acceptable data eye opening width and eye opening height. A differential probe should be used to measure
across the termination resistor at the CMLOUT+/- pin Figure 3 .
PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS
Circuit board layout and stack-up for the FPD-Link III devices should be designed to provide low-noise power
feed to the device. Good layout practice will also separate high frequency or high-level inputs and outputs to
minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly
improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane
capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at
high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the
range of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2 µF to 10 µF range. Voltage rating of the
tantalum capacitors should be at least 5X the power supply voltage being used.
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50µF to 100µF range and will smooth low frequency switching noise. It is
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external
bypass capacitor will increase the inductance of the path.
A small body size X7R chip capacitor, such as 0603 or 0402, is recommended for external bypass. Its small body
size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing
the impedance at high frequency.
Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power
pin pairs. In some cases, an external filter may be used to provide clean power to sensitive circuits such as
PLLs.
Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the CML
lines to prevent coupling from the LVCMOS lines to the CML lines. Closely-coupled differential lines of 100Ω are
typically recommended for CML interconnect. The closely coupled lines help to ensure that coupled noise will
appear as common-mode and thus is rejected by the receivers. The tightly coupled lines will also radiate less.
Information on the WQFN style package is provided in TI Application Note: AN-1187 (SNOA401).
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