AM1707_1008 Datasheet, PDF (195/199 Pages) Texas Instruments – ARM Microprocessor

AM1707
www.ti.com
SPRS637A – FEBRUARY 2010 – REVISED APRIL 2010
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZKB]
PARAMETER
°C/W ⁽¹⁾
°C/W ⁽²⁾
AIR FLOW (m/s)⁽³⁾
RΘ_JC
RΘ_JB
RΘ_JA
Junction-to-case
Junction-to-board
Junction-to-free air
12.8
13.5
N/A
15.1
19.7
N/A
24.5
33.8
0.00
21.9
30
0.50
RΘ_JMA
Junction-to-moving air
21.1
28.7
1.00
20.4
27.4
2.00
19.6
26
4.00
0.6
0.8
0.00
0.8
1
0.50
Psi_JT
Junction-to-package top
0.9
1.2
1.00
1.1
1.4
2.00
1.3
1.8
4.00
14.9
19.1
0.00
14.4
18.2
0.50
Psi_JB
Junction-to-board
14.4
18
1.00
14.3
17.7
2.00
14.1
17.4
4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness.
Power dissipation of 1W and ambient temp of 70C assumed.
(3) m/s = meters per second
8.3 Mechanical Drawings
This section contains mechanical drawings for the device.
Copyright © 2010, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information 195
Submit Documentation Feedback
Product Folder Link(s): AM1707