AM1707_1008 Datasheet, PDF (194/199 Pages) Texas Instruments – ARM Microprocessor

AM1707
SPRS637A – FEBRUARY 2010 – REVISED APRIL 2010
www.ti.com
8 Mechanical Packaging and Orderable Information
This section describes the device orderable part numbers, packaging options, materials, thermal and
mechanical parameters.
8.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
AM1xxx processors and support tools. Each commercial AM1xxx platform member has one of three
prefixes: X, P, or null (no prefix). Texas Instruments recommends two of three possible prefix designators
for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product
development from engineering prototypes (TMDX) through fully qualified production devices/tools (TMDS).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications.
P
Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification.
NULL
Fully-qualified production device.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
NULL devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
Figure 8-1 provides a legend for reading the device.
X
AM1707
( ) ZKB ( ) 3
PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE
SILICON REVISION
B = Silicon Revision 2.0
DEVICE SPEED RANGE
3 = 375 MHz
4 = 456 MHz
TEMPERATURE RANGE (JUNCTION)
Blank = 0°C to 90°C (Commercial Grade)
D
= -40°C to 90°C (Industrial Grade)
A
= -40°C to 105°C( Extended Grade)
T
= -40°C to 125°C( Automotive Grade)
PACKAGE TYPE
ZKB = 256 Pin Plastic BGA, with Pb-free
Soldered Balls [Green]
Figure 8-1. Device Nomenclature
8.2 Thermal Data for ZKB
The following table(s) show the thermal resistance characteristics for the PBGA–ZKB mechanical
package.
194 Mechanical Packaging and Orderable Information
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