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LSM6DS33 Datasheet, PDF (72/77 Pages) STMicroelectronics – iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope
Soldering information
12 Soldering information
LSM6DS33
The LGA package is compliant with the ECOPACK®, RoHS and "Green" standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave "Pin 1 Indicator" unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
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DocID027423 Rev 4