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K4B1G0446D Datasheet, PDF (6/60 Pages) Samsung semiconductor – 1Gb D-die DDR3 SDRAM Specification
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K4B1G04(08/16)46D
1Gb DDR3 SDRAM
3.0 Package pinout/Mechanical Dimension & Addressing
3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls)
1
2
3
4
567
8
9
10
11
A
NC
VSS
VDD
NC
NC
VSS
VDD
NC
A
B
VSS
VSSQ
DQ0
DM
VSSQ
VDDQ
B
C
VDDQ
DQ2
DQS
DQ1
DQ3
VSSQ
C
D
VSSQ
NC
DQS
E
VREFDQ
VDDQ
NC
F
NC
VSS
RAS
VDD
VSS
VSSQ
D
NC
NC
VDDQ
E
CK
VSS
NC
F
G
ODT
VDD
CAS
CK
VDD
CKE
G
H
NC
CS
WE
A10/AP
ZQ
NC
H
J
VSS
BA0
BA2
NC
VREFCA
VSS
J
K
VDD
A3
A0
A12/BC
BA1
VDD
K
L
VSS
A5
A2
A1
A4
VSS
L
M
VDD
A7
A9
A11
A6
VDD
M
N
NC
VSS
RESET
A13
NC
A8
VSS
NC
N
Note : Green NC balls (A1, A11, N1 and N11) indicate mechanical support balls with no internal connection.
Ball Locations (x4)
Populated ball
Ball not populated
Top view
(See the balls through the package)
1 2 3 4 5 6 7 8 9 10 11
A
B
C
D
E
F
G
H
J
K
L
M
N
Page 6 of 60
Rev. 1.1 August 2008
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